Thin-Film Coating Deposition Methodologies for Electronic Protection
Thin-film deposition is the process of adding a layer of material onto a substrate, part, or assembly to enhance its properties. Various deposition techniques may serve this purpose and can all be grouped into three categories: liquid coating deposition, chemical vapor deposition, and physical vapor deposition. As one selects a thin-film coating, the intended application method, scalability, tolerance, and other factors should be considered. Ultimately, the technique and materials are chosen depending on the performance, production requirements, and budget unique to the application.
Thin-film deposition is a dynamic process for building and depositing thin-film coatings onto a part, substrate, or assembly. The coatings can be based on various materials, including metals, ceramics, polymers, and more exotic chemistries. A solid, liquid, gas, or combination of materials transforms through an electrical or chemical reaction to deposit a thin coating on to a substrate in all methods.
The deposition process will depend on the chosen material, desired outcome, and production considerations. These deposition processes fall into three general groups – liquid coating deposition techniques, chemical vapor deposition, and physical vapor deposition. Each method has advantages, disadvantages, and variables that should be considered and may include material, process, and performance considerations. Download the white paper to learn more.